5-9 September 2016
Prague Congress Centre
Europe/Prague timezone

P2.187 Study on the optimization of Cu/SS explosion bonding for ITER first wall components

6 Sep 2016, 14:20
1h 40m
Foyer 2A (2nd floor), 3A (3rd floor) (Prague Congress Centre)

Foyer 2A (2nd floor), 3A (3rd floor)

Prague Congress Centre

5. května 65, Prague, Czech Republic
Board: 187
Poster I. Materials Technology P2 Poster session

Speaker

Pinghuai Wang (Southwestern Institute of Physics)

Description

The CuCrZr/316L(N) explosion bonding bimetallic plates were used to make hypervapotron (HVT) cooling channel for the fingers, which is the key components of the ITER First Wall (FW). The bimetallic plates will be subjected to the same thermal cycles as the FW component, including the HIP (hot iso-static pressing) joining for bonding HVT and beryllium tiles, thus the properties of both the CuCrZr /316L(N) joints and the CuCrZr alloy will be changed even cannot meet the design requirement. Several batches of CuCrZr/316l(N)-IG joints were obtained by explosion bonding. Visual test and ultrasonic examination were conducted for the explosion bonding plates, samples were cut from the plate in different conditions for the tensile testing, metallographic examination (microscopic and macroscopic) and hardness testing. The results shows that a solid solution annealing heat treatment was necessary to recover the tensile strength of CuCrZr alloy as well as the deformation of CuCrZr /316L(N) joint interface so that the risk of stress inducing corrosion will be significantly reduced. In addition, the optimization of manufacturing process for the CuCrZr/316L(N) bimetallic plates and the HIP parameter will benefit the properties control of the materials.

Co-authors

Danhua Liu (Southwestern Institute of Physics, Chengdu, China) Jiming Chen (Southwestern Institute of Physics, Chengdu, China) Pinghuai Wang (Southwestern Institute of Physics, Chengdu, China) Qian Li (Southwestern Institute of Physics, Chengdu, China)

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