Speaker
Sukhwal Ma
Description
See the full Abstract at http://ocs.ciemat.es/EPS2018ABS/pdf/P2.3020.pdf
Purification of water-soluble cutting fluid using an air DBD plasma and its
characteristic analysis
S.H. Ma1, 2, K.I. Kim2, Y.C. Hong2,*
1
Department of Applied Plasma Engineering, Chonbuk National University, Jeonju, Korea
2
Plasma Technology Research Center, National Fusion Research Institute, Gunsan, Korea
E-mail: ychong@nfri.re.kr
Cutting fluids are essential for cutting performance and rust prevention in metalworking
processes. Among cutting oils, the usage of water-soluble cutting fluids is increasing rapidly
because they afford excellent cooling performance and ensure fire safety. However,
water-soluble cutting fluids also offer a favorable environment for the growth of a wide variety
of microorganisms. The growth of microorganisms can lead to various problems such as
deterioration of the cutting fluids and odor generation. Thus, technologies for purifying the
waste of water-soluble cutting fluids are required. In this study, we developed an ozone
treatment technology that uses an air DBD plasma system. Furthermore, sterilization
experiments were performed with K. pneumoniae, P. aeruginosa, E. coli, and P. vulgaris as
representative microorganisms. The system offers the advantages of low power consumption
and simple structure. Approximately 1000 ppm of ozone could be stably generated under
optimized conditions, and the ozone was injected into the reactor as micro-bubbles for
improving reactivity and inactivation rate. The sterilization experiments confirmed that the
water-soluble cutting fluid was sterilized by 99.99%. As a result, the turbidity, pH, and odor of
water-soluble cutting fluid have been improved.
(a)
Fig. 1. Schematic drawing of the developed (b)
DBD system grounded with (a) coiled
copper or (b) surrounded water for purifying Fig. 2. Photographs showing the stable DBD
waste water-soluble cutting fluids plasma from air gas grounded with (a) coiled
electrode and (b) surrounded with water.
References
[1] Y.C. Hong and H.S. Uhm, Appl. Phys. Lett., 89, 221504 (2006).
[2] S.H. Ma, K.I. Kim, J.Y. Huh and Y.C. Hong, Sep. Purif. Technol. 188, 147 (2017)
